| Fatigue Life Degradation Modeling of SnAgCu Solder Joints After Aging | ---- | ---- | 10 | ---- | 2020-06-05 00:00:00 |
| Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions. | Hani, D. B., Al Athamneh, R., Aljarrah, M., & Hamasha, S. D. | Journal of Microelectronics and Electronic Packaging | 18 | ---- | 2021 |
| Fatigue life degradation modeling of SnAgCu solder joints after aging. | Al Athamneh, R., Hani, D. B., & Ali, H. | EEE Transactions on Components, Packaging and Manufacturing Technology, | 10(7), 1175-1184. | IEEE | 2020 |
| Modeling the Effect of Magnesium Content on the Electrical Conductivity and Hardness of Technical Aluminum (1050) Alloy | Dania Bani Hani 1 , Raed Al Athamneh 2 , Zaid Albataineh 1,*, Mustafa Rawashdeh 2 and Issam Makableh | Crystals | ---- | ---- | 25-3-2022 |
| Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints | Dania Bani Hani; Raed Al Athamneh; Sa’d Hamasha | IEEE Transactions on Device and Materials Reliability | 22 | IEEE | 29-3-2022 |
| Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions | Dania Bani Hani; Raed Al Athamneh; Mohammed Aljarrah; Sa’d Hamasha | Journal of Microelectronics and Electronic Packaging | 18 | International Microelectronics And Packaging Society | 7-9-2021 |
| Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions | Raed Al Athamneh, Mohammed Abueed, Dania Bani Hani, Sa’ Hamasha | Crystals | 12 | MDPI | 20-5-2022 |
| Factor Analysis of Quality Management Systems Implementation in Healthcare: An Online Survey | Mustafa Rawshdeh, Heather Keathley, Shahed Obeidat, Raed Athamenh, Moayad Tanash, Dania Bani Hani | Healthcare | 10 | MDPI | 2022/9/21 |
| A PDCA Framework towards a Multi-Response Optimization of Process Parameters Based on Taguchi-Fuzzy Model | Moayad Tanash, Raed Al Athamneh, Dania Bani Hani, Mumen Rababah, Zaid Albataineh | Processes | 10 | MDPI | 2022/9/18 |
| Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions | Raed Al Athamneh, Mohammed Abueed, Dania Bani Hani, Sa’d Hamasha | Crystals | 12 | MDPI | 2022/5/26 |
| Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model | Bani Hani, D., Al Athamneh, R., Abueed, M., & Hamasha, S. D. | Scientific reports | Sci Rep 13, 2493 (2023). | Springer Nature | 13-2-2023 |
| Variable Neighbor hood Search Algorithm for the Single Assignment Incomplete Hub Location Problem with Modular Capacities and Direct Connections | RaedALAthamneha,MoayadTanasha,∗,DaniaBaniHanib,MustafaRawshdeha, AbdallahAlawina,ZaidAlbataineh | Operations research perspectives | 11 | Elsevier | 1-12-2023 |
| Arrhenius Fatigue Life Modeling for Lead-free Solder Joints in Accelerated Combined Fatigue and Creep Tests at Different Operating Temperatures | R. A. Athamneh, D. B. Hani, S. Hamasha and M. Abueed, | IEEE Transactions on Components, Packaging and Manufacturing Technology | 1 | IEEE | 10-3-2023 |
| Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints. | Bani Hani, D., Al Athamneh, R., Abueed, M., & Hamasha, S. D. | Sci Rep | 13 | Springer Nature | 26-5-2023 |
| Assessing the accuracy of a wireless sensor system for estimating lumbar moments during manual lifting tasks considering the effects of load weight, asymmetry, and height | Iván Nail-Ulloa a b , Rong Huangfu b , Michael Zabala a , Dania Bani Hani c , Nathan Pool b , Howard Chen d , Mark C. Schall Jr. b , Richard Sesek b , Sean Gallagher b | International Journal of Industrial Ergonomics | 103 | ---- | 31-8-2024 |